Vision RIE (Reactive Ion Etch mode)

Advanced Vacuum’s Vision RIE provides etch capability for R&D, prototyping, and low volume production. This parallel-plate capacitance based systems is found in applications that include fundamental material studies, surface modification, semiconductor device fabrication, and failure analysis involving delayering. 

This system, found in both academic and industrial environments, is a result of their small footprint along with robust construction that focuses on ease of use and low maintenance. The Vision systems satisfy the high reliability requirements for critical applications such as delayering where production is dependent on constant input from the Failure Analysis department. Being outside of the fabrication process, means that the system must have turnkey operation for non-etch process oriented engineers.

Hardware

  • Up to 10 gas channels
  • Close couple turbo pump for high conductance
  • 305mm substrate platen
  • CE/UL compliant
  • DeviceNet (digital) field bus for faster, more accurate, and trouble free operation
  • Open load for easy access
  • Best-of-breed OEM components (standard “off the shell”) for fast parts availability
  • Digital MFCs (metal sealed, isolated)
  • Compact footprint (<0.6 m2)

Software

  • User friendly Digital communication using DeviceNet
  • Data logging and recipe management through open SQL Server environment
  • Integrated endpoint control
  • Alarm history, multiple user access levels, on-the-fly recipe control
  • Real-time process data display
  • Easy and safe override maintenance screens

Processes

  • Extensive etch process library that includes
    • Dielectrics (e.g. SiNx, SiO2, a-Si, SiOxNy, Ta2O5)
    • Metals (fluorine based or sputtered etched)
    • Polymers (e.g. polyimide, BCB, photoresist)
    • Compound Semiconductors (fluorine based, e.g. SiC,, H2/CH4 e.g. InP)
  • Surface treatment (e.g. O2 surface modification of patterned sapphire)
  • Descum

 

 

     
   
 
       

 

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