TECHNOLOGY

Advanced Vacuum offers a range of technologies for the etching and deposition of a variety of different materials. Advanced Vacuum also offers a range of Vacuum technology.

Etch

RIE — Reactive Ion Etching uses a parallel plate configuration with an RF biased substrate electrode.
PEPlasma Enhanced Reactive Ion Etching uses a parallel plate configuration with an RF biased upper electrode.
ICPInductively Coupled Plasma high density source and a RF biased lower electrode

Deposition

PECVD — Plasma Enhanced Chemical Vapor Deposition runs in parallel plate mode with RF power applied to the upper electrode.
HDPCVD — High Density Plasma Chemical Vapor Deposition combines the advantages of a high density plasma ICP source with PECVD allowing for the extension of deposition technology to significantly lower temperatures and better higher density films.

Vacuum

Advanced Vacuum provides a full range of services related to vacuum technology starting with the sale of vacuum components such as flanges and fittings. Advanced Vacuum also offers design services for custom vacuum solutions for a wide range of markets. Also available are fully integrated vacuum systems for general or specific applications.

For more information and technical papers please click here.

     
   
 
       

 

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